JPH05857B2 - - Google Patents

Info

Publication number
JPH05857B2
JPH05857B2 JP63165082A JP16508288A JPH05857B2 JP H05857 B2 JPH05857 B2 JP H05857B2 JP 63165082 A JP63165082 A JP 63165082A JP 16508288 A JP16508288 A JP 16508288A JP H05857 B2 JPH05857 B2 JP H05857B2
Authority
JP
Japan
Prior art keywords
tab tape
adhesive layer
tape
adhesive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63165082A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0215644A (ja
Inventor
Hitoshi Narushima
Yoshikazu Tsukamoto
Atsushi Koshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP16508288A priority Critical patent/JPH0215644A/ja
Publication of JPH0215644A publication Critical patent/JPH0215644A/ja
Publication of JPH05857B2 publication Critical patent/JPH05857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Wire Bonding (AREA)
JP16508288A 1988-07-04 1988-07-04 Ｔａｂ用テープ Granted JPH0215644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16508288A JPH0215644A (ja) 1988-07-04 1988-07-04 Ｔａｂ用テープ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16508288A JPH0215644A (ja) 1988-07-04 1988-07-04 Ｔａｂ用テープ

Publications (2)

Publication Number Publication Date
JPH0215644A JPH0215644A (ja) 1990-01-19
JPH05857B2 true JPH05857B2 (en]) 1993-01-06

Family

ID=15805532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16508288A Granted JPH0215644A (ja) 1988-07-04 1988-07-04 Ｔａｂ用テープ

Country Status (1)

Country Link
JP (1) JPH0215644A (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114222B2 (ja) * 1991-07-24 1995-12-06 株式会社巴川製紙所 Ｔａｂ用テープ
JP2835797B2 (ja) * 1992-04-10 1998-12-14 株式会社 巴川製紙所 Ｔａｂ用テープ
EP0551512B1 (en) * 1990-01-23 1995-04-12 Tomoegawa Paper Co. Ltd. Tape for tab
JP2533009B2 (ja) * 1991-04-09 1996-09-11 株式会社巴川製紙所 フィルムキャリア用接着テ―プの製造方法
US5523137A (en) * 1991-07-24 1996-06-04 Tomoegawa Paper Co., Ltd. Adhesive paper for tape automated bonding
JPH07176573A (ja) * 1993-12-20 1995-07-14 Tomoegawa Paper Co Ltd 半導体装置用接着剤およびそれを使用した部材
US5707730A (en) * 1993-12-20 1998-01-13 Tomoegawa Paper Co. Ltd. Adhesive for semiconductor device and reinforcing material using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134365A (en) * 1977-04-28 1978-11-22 Toray Industries Semiconductor ic carrier tape and method of producing same
JPS5714786A (en) * 1980-06-30 1982-01-26 Seiko Epson Corp Electronic timepiece equipped with temperature detector

Also Published As

Publication number Publication date
JPH0215644A (ja) 1990-01-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees